| 供應(yīng)商 | 北京汐源科技有限公司 店鋪 |
|---|---|
| 認(rèn)證 | |
| 報(bào)價(jià) | 面議 |
| 關(guān)鍵詞 | 漢高ABLESTIKJM7000導(dǎo)電膠 |
| 所在地 | 北京建國(guó)路15號(hào)院 |
9年
LOCTITE ABLESTIK JM 7000 die attach adhesive has been
formulated for use in high throughput die attach applications. This
material has been used successfully on rigid substrates with die sizes
up to 700 mils.
LOCTITE ABLESTIK JM 7000 has been approved by DESC and
Rome Laboratory for military products.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties
Coefficient of Thermal Expansion, :
Below Tg, ppm/°C 33
Glass Transition Temperature (Tg) by TMA, °C 240
Bulk Thermal Conductivity, W/(m-K):
@ 90°C 1.1
@ 165°C 1.0
Tensile Modulus, DMTA :
Cured 30 minutes @ 300oC N/mm2 10,000
(psi) (1,450,377)
Extractable Ionic Content, @ 100°C:
Chloride (Cl-) <10
Sodium (Na+) <15
Potassium (K+) <15
Decomposition (in N2):
TGA analysis @ 10oC/ minute ramp from 25 to 400
oC
@ 340oC, % 0.2
@ 400oC, % 0.3
Electrical Properties
Sample cured 30 minutes @ 300oC
Volume Resistivity, ohm-cm ≤0.01
TYPICAL PERFORMANCE OF CURED MATERIAL
Die Shear Strength:
2 X 2 mm Si die, kg-f,
cured 20 minutes @ 150oC
Substrate DSS
Ag/Cu LF ≥5
Tensile Strength :
cured 30 minutes @ 300oC, MPa
After Cure After 1000 TC'C"
>17 >17
Radius of Curvature:
Si die on Alumina, meters
cured 30 minutes @ 300oC
Chip Size: ROC
15 x 15 mm > 5
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